Returning to his senior year of high school, he went all in and made billions by buying at the botto

November 20th.

Tsinghua-Jiamusi Microelectronics Joint Research Center.

As soon as Chen Mo entered the conference room on the third floor, he saw that the long table was already full of people.

Gu Shaoting, Wu Huaqiang, and Wei Jun were all present.

Professor Liang, who is in charge of advanced packaging, sat next to the projection screen with more than a dozen cross-sectional diagrams spread out in front of him.

Chen Jing stood in front of the projection screen.

She was wearing a loose gray sweatshirt, her hair was simply tied back, and she had blue light blocking glasses perched on her nose.

After several days without proper rest, faint dark circles had appeared under his eyes, yet he seemed extremely excited.

"Continue, don't worry about me." Chen Mo pulled out a chair in the back corner and sat down quietly.

The screen displayed a set of appalling test data.

The first-generation verification chip used 2.5D chip splicing, requiring high-density interconnection of computing and storage units through a silicon interposer.

For nearly a month, the packaging group has been tormented by a fatal flaw: the resistance of the connection points increases dramatically after high and low temperature cycles, and in the most severe cases, the circuit is even broken.

For this issue, the packaging team cleaned the wafers, adjusted the pressure, and some even suggested completely overhauling the connection point structure.

But if we start over, all the previous plans and masks will be wasted, and the project will be delayed by at least two months!

"This is the coordinate diagram of the first three batches of failed samples."

Chen Jing pressed the page turner, and hundreds of striking red dots instantly pierced the calm.

"If we don't stack the three batches of data according to time, but rather according to spatial coordinates, we will find that the problem is not surface contamination at all, but is precisely concentrated in a ring-shaped area four to six millimeters from the edge of the wafer."

Professor Liang frowned: "What's the conclusion?"

"Temperature and stress."

Chen Jing's voice was firm and resolute: "The previous process involved a rapid, one-time heating up. The thinned silicon wafer and the carrier wafer had different thermal expansion rates, and during the most intense 90 seconds of heating, the wafer edge experienced micron-level warping. It wasn't noticeable at the time, but after several rounds of heating and cooling cycles, the hidden dangers would be magnified infinitely."

A senior researcher in the packaging team couldn't help but speak up: "That's not right. The average warpage monitored by the equipment is well within the safety range."

"That's being fooled by the average."

Chen Jing directly displayed an infinitely magnified peak chart: "The system generated the average data for the entire dataset, erasing the instantaneous and violent fluctuations in the edge areas within those ninety seconds."

Instantly, the entire conference room fell silent.

Professor Liang sat bolt upright, opened the report in his hand, and gasped: "These millisecond-level raw records number in the tens of thousands... You single-handedly cleaned, categorized, and cross-validated them all?!"

"I wrote a small program and ran it all night," Chen Jing replied casually.

Professor Liang's fingers trembled slightly as she flipped through the report, and she began to re-examine the young woman in front of her for the first time.

At first, everyone knew that she was Chen Mo's older sister.

Even if no one says it outright, people can't help but feel that this undergraduate student's ability to stay in a top-tier lab is partly due to "nepotism."

But this report before us, with its more than 17,000 seemingly random entries, is logically sound. Who would dare say that she relied on connections?

"Has it been verified by experiments?" Gu Shaoting broke the silence.

Professor Wu Huaqiang smiled and took over the projector: "Last night, we made two small-scale tests according to the plan Chen Jing gave us. The failure rate dropped directly from 19% to 1.7%."

Data doesn't lie.

Professor Liang stared at the screen for a long time, finally letting out a long sigh of relief, and slammed his hand on the table: "Leave the original design as is! Expand the entire test according to Chen Jing's new process. If the stability meets the standards after three rounds, freeze the plan immediately!"

Upon hearing the words "the original image remains unchanged," the core researchers present breathed a sigh of relief and almost cheered.

This junior college student single-handedly pulled the two-month delay crisis back from the brink!

Gu Shaoting adjusted his glasses, his gaze landing on Chen Jing: "Third year? Materials science?"

"right."

Have you worked with advanced packaging before?

"Before summer vacation, I had only seen it in literature," Chen Jing said neither humbly nor arrogantly.

Gu Shaoting nodded and immediately made the decision: "Starting today, there's no need to do peripheral data processing anymore. Go directly to the core packaging reliability group and participate in the weekly top-level meetings."

Chen Jing's eyes lit up instantly.

Qingjia's technical classification is extremely strict. Entering the core meeting means that she will officially join the core think tank of this domestically produced cutting-edge chip!

"Professor Gu, isn't that a bit unfair of you?" Professor Wu Huaqiang, who was standing nearby, became anxious and quickly spoke up, "Chen Jing is going to study under me as a graduate student after graduation. You can't just snatch her away like that!"

Gu Shaoting glanced at him: "What, good prospects can only follow the established path in your department, but can't they take on important roles here?"

A burst of good-natured laughter erupted in the conference room, instantly dispelling the gloom that had been building up for a month.

Chen Jing stood in front of the stage, suppressing the urge to cheer.

She subconsciously raised her gaze and looked through the crowd at Chen Mo in the back row.

Chen Mo leaned back in his chair, a smile playing on his lips, and gave his sister a thumbs-up in perfect cooperation.

Seeing the thumbs-up, Chen Jing proudly raised her chin, her eyes unrestrained and lively, as if silently declaring to Chen Mo:

See that? Boss Chen, I earned my living through real skills, I didn't take advantage of you in the slightest!

……

After the packaging issue was resolved, Wen Zhixia sent the latest progress of the European cooperation to the meeting screen.

After returning from Paris, Creation Europe and Jianing Holdings jointly established a special coordination team.

The first response from France has arrived.

A silicon photonics team in Grenoble is willing to engage in closed-door technical exchanges with Qingjia.

The two parties started by discussing modulator temperature drift, optical coupling, and packaging tolerances, without involving any core data subject to export restrictions.

A French SOI materials company has agreed to supply two batches of research-grade test wafers.

The Belgian side has also confirmed the date of the first closed-door seminar.

Ching Chia can send six researchers to discuss the reliability of wafer bonding, memory, and logic integration.

The resources that can truly change the project's progress immediately come from the Netherlands.

After coordination by a European family met at the St. Clair meeting, a medium-sized Dutch equipment company agreed to deliver the high-precision bonding alignment module and vacuum chamber control system ahead of schedule.

This batch of equipment was originally scheduled for the second quarter of the following year.

The export and legal reviews are now complete.

The two core modules are being transported to Beijing.

The other party will also send four engineers to be responsible for installation, debugging and operation training.

It is expected to arrive in Qingjia within ten days.

"The accuracy of this alignment module is sufficient to support the first-generation verification chip."

Professor Liang quickly reviewed the equipment parameters.

"The two rounds of testing that were originally planned to be completed by an external platform can now be done directly at Ching Chia."

"At least another six weeks saved."

Wu Huaqiang looked at Chen Mo.

"You went to Paris and brought back quite a lot of stuff for the lab."

Chen Mo did not mince words: "The thing scientific research lacks most is time."

Professor Liang continued.

"If the equipment arrives six months late, the team will have to wait another six months. By the time the equipment is finally in place, the original team members may have already moved on to other projects."

Gu Shaoting did not participate in the group's reflections.

He walked to the whiteboard and reviewed the original schedule from the beginning.

The first-generation verification architecture has been frozen.

The computing, control, and storage core has completed the main functional design.

The unified interconnection protocol has entered its final round of simulation.

The structural rework that the silicon interposer might have faced was avoided by the new process that Chen Jing found.

The Dutch equipment filled the gap in the bonding and packaging verification process.

SMIC has already coordinated a shared 28-nanometer tape-out window.

If the layout verification and process documentation are completed on time, the first batch of chips can catch up with the latest schedule.

Gu Shaoting picked up the eraser and wiped away the words "nine months" from the timetable.

"The plan has been moved up."

He wrote down a new date next to it.

End of March 2016.

"Complete the tape-out documentation delivery before the Spring Festival."

"After receiving the first batch of wafers after the Spring Festival, we immediately began cutting, packaging, and system testing."

Wu Huaqiang cautioned, "The premise is that no major problems arise in any of the subsequent steps."

"How can you make chips without encountering problems?"

Gu Shaoting put down his pen.

"Solve the problem if it arises."

Anyway, I'm putting my words here.

"If all goes well, I want to see the first batch of complete engineering samples on this table after the Spring Festival."

Everyone in the conference room looked at the whiteboard.

It has only been a little over two months since the project was officially launched.

The original twelve-month first-phase goal has been compressed to less than six months.

No single advancement, taken in isolation, could have created this speed.

Chen Mo's advance technical guidance helped the team avoid going in the wrong direction.

The experts gathered by Gu Shaoting filled in the gaps in system architecture, packaging, storage, and software.

Chen Jing discovered the pattern of edge failure from massive amounts of data.

European resources address the time lag between equipment and materials.

These forces finally converged on the same path.

……

three days later.

The expert group from the National Integrated Circuit Industry Investment Fund visited Qingjia again.

This review was not held in public.

All participants left their mobile phones outside the meeting area.

All presentation materials were placed in isolation and collected on-site after the meeting.

The expert group examined the project architecture and simulation results, then proceeded to bond testing, and subsequently inquired about the tape-out, packaging, and industrialization plans.

When the National Integrated Circuit Industry Investment Fund (Big Fund) initially invested in Tsinghua Jiasheng, it valued the platform jointly built by Gu Shaoting, Tsinghua University, and Jiasheng Holdings.

Today, Qingjia has proven with real data that this technical approach is not just confined to a sixty-plus-page solution.

It is gradually becoming a manufactureable chip.

The day after the review ended.

The National Integrated Circuit Industry Investment Fund (Big Fund) Investment Committee has approved in principle the additional investment plan.

The additional 500 million yuan will be invested in Qingjia in two phases.

The first phase is used for the tape-out of 28-nanometer verification wafers, the construction of advanced packaging and testing platforms.

The second phase is linked to the test results of the engineering samples.

Jianing Holdings exercised its preemptive right to continue to maintain its position as the largest shareholder of Qingjia.

Tsinghua Venture Capital and the Tsinghua Institute of Technology's technology transfer platform will also co-invest in accordance with the original agreement.

Once the funds were received, Ching Chia no longer needed to repeatedly weigh the number of tape-outs and equipment budget in the first phase.

If the first batch of samples fails, the project team still has enough resources to quickly modify them and conduct a second or even third verification.

At the same time, the confidentiality level of the Qingjia 3D heterogeneous integration project has been raised again.

The project's core architecture, chip interfaces, failure bypass, and packaging parameters are all placed in Qingjia's highest-level access directory.

All R&D data was migrated to a separate intranet.

Different research groups open up data according to their respective tasks.

The participants underwent background checks and confidentiality training again.

Cooperation involving Europe was separated out.

The foreign team can only access the materials, equipment, or testing modules they are responsible for, and cannot see the entire system architecture.

In its public announcements, Ching Chia still only disclosed "research on new storage and advanced packaging".

The full name of the 3D heterogeneous integration project has disappeared from public documents for the first time.

An additional access control system has been added to the laboratory entrance.

Chen Jing affixed the new access card to the sensor area.

A short notification sound rang out.

The area, which was originally only accessible to professors, PhDs, and core engineers, was opened to her for the first time.

She paused at the door for a second, then turned to look at Chen Mo.

"Will we really see chips after the Spring Festival?"

Chen Mo smiled and said, "I believe in you."

"Then I need to check the questions again."

Chen Jing turned and walked into the laboratory.

The glass door slowly closed behind her.

On the whiteboard on the other side of the corridor, the new timetable has officially come into effect.

The first batch of engineering sample pieces.

End of February 2016.