After the layoffs, I became a tech godfather

Chapter 177 The exclamation of top experts: A true three-dimensional chip - silicon-carbon fusion semiconductor!

Many things are deeply rooted.

The establishment of scientific discourse power in the Western world did not happen overnight.

In the more than 300 years since the 1760s, China has missed several opportunities for development.

It is only now, in the era of information technology and intelligence, that we have slowly caught up.

The right to speak...

"Education is actually the first thing that should be changed," Hao Cheng said very radically: "Why do we have to publish SCI to advance? How many Chinese journals are there in SCI? Previously, there was really no other way. We had to integrate into the mainstream of the world.

"But, in the future, I hope we will be the mainstream of the world!"

Hao Cheng and Wei Shujie have also discussed this issue - an evaluation system is always needed, and the subjective method is definitely not feasible in China, so evaluation by papers has become the gold standard for a long period of time.

However, the situation is different now, because Xiaosha itself can be used as an evaluation system.

Hao Cheng and Wei Shujie have also reached an agreement with the University of Information Science and Technology to pilot the reform of the evaluation system in their project.

"I will keep an eye on your pilot project," Professor Wang Yuan said. "If possible, I will recommend Huaxia University to implement your evaluation system and standards. At the very least, I will follow up in our college."

As the dean of the Institute of Frontier Interdisciplinary Studies, Professor Wang Yuan also has a certain status and voice in the school. At least, he can make the final decision on matters concerning the Institute of Interdisciplinary Studies.

He had mentioned the idea of introducing Xiaosha as part of the evaluation system at a school assembly before. However, it was not passed because it affected the interests of too many people and was temporarily shelved.

Hao Cheng and Professor Wang Yuan chatted for a very long time. The more they talked, the more they got along, and the more they felt that they had met too late.

When Professor Wang Yuan left, he even walked with a brisk pace. Although he was not very tall, he looked mighty at this time, and he looked a lot younger.

After seeing Wang Yuan off, Hao Cheng received batch after batch of guests.

Including potential partners to whom Xiaosha is about to open up its AI training capabilities, domestic companies that design and produce chips, etc., there was not a single moment of free time the whole day.

Hao Cheng attaches great importance to experts in chip production.

The core architecture of the first micro-consciousness chip that Baiju Technology has developed has been completed. The remaining issue is to design the specific chip in combination with current manufacturing capabilities.

The expert in the afternoon was named Chu Bai, and was brought by Yu Dong.

When Yu Dong introduced him, he mentioned three key words: Kirin 9200, Taishan core, and new packaging solution.

His position at Huawei is chip engineer, expert, and deputy director of the Scientist Committee.

At his level, he is very cautious even when traveling domestically.

After all, there are too many experts who have gotten into accidents for no reason. In recent years, there have been more than a dozen accidents due to car accidents alone.

If I say it was all an accident, I'm afraid no one will believe it.

Originally, when Hao Cheng suggested finding an expert to evaluate the chip, Huawei was not prepared to let an expert of Chu Bo's level come forward. After all, Hao Cheng also said that it was just a simple discussion and nothing else was involved.

But after Chu Bai learned the news, he directly contacted Yu Dong through Mr. He and insisted on coming to see it in person. "Engineer Chu, this is my idea..."

Hao Cheng did not tell him about micro-consciousness chips or anything like that. Instead, he carried out multi-dimensional stacking of chips according to the concept of three-dimensional chips, starting with the stacking of silicon wafers and then the stacking of circuits on each layer of silicon wafers.

Silicon wafer stacking currently uses port input, while the stacking of circuits inside the silicon wafer uses carbon nanotubes for dense through holes to achieve circuit connection for each layer.

Ultimately, the entire chip presents a fully three-dimensional structure.

"This……"

The design of stacked chips is not uncommon, but current technology can only realize the stacking of simple circuits, such as memory chips, which have relatively simple circuits. Now it is possible to design and manufacture circuits with hundreds of layers on a single silicon wafer, so as to realize larger memory particles in the same area.

But memory chips are simple, and each layer is almost the same.

Although it is theoretically feasible for the core processor SOC to do this, the difficulty will increase by more than an order of magnitude!

There may be people doing relevant research in the laboratory, but there is currently no actual production.

Originally, Chu Bai was still wondering whether Hao Cheng was eager to solve the chip problem and was a little whimsical. But when he saw Hao Cheng's design plan, he instantly understood: It's not that Hao Cheng is whimsical, but I am just looking at the world from a narrow perspective!
"This……"

"This……"

"This……"

This chip is only used to express the design concept. What Hao Cheng designed is not complicated. It is roughly equivalent to the level of the 1978 chip with X86 architecture released by Intel in 8086.

Even so, Chu Bai was completely shocked.

Every place I see is filled with ingenuity, especially the world where layers of silicon semiconductors are connected by through-holes made of carbon nanotubes, which is an ingenious work.

"No one has ever had such an idea!" said Chu Bai.

Chu Bai said no, but in fact there is. Even this idea was found by Xiaosha through public papers. It was just further upgraded by combining some concepts and methods of micro-consciousness.

"You are right, there is, but what is the current through silicon via?" Chu Bo retorted: "It is a wafer-level stacking, a vertical through hole between layers. Strictly speaking, it is a packaging technology.

"Let's not talk about anything else. Our country is even the world leader in this technology, but can it solve the problem of high-end chip manufacturing? No!"

Chu Bai became more and more excited as he spoke: "But your proposal is to use nano-carbon to make 360-degree through holes inside the wafer. Is this a through silicon via? It's shaped like a hornet's nest and spider web!

"In other words, is chip stacking technology really three-dimensional? Is stacking two layers of two-dimensional chips three-dimensional? Or is stacking two hundred layers three-dimensional?"

This question stumped Hao Cheng. How many layers are considered three-dimensional? But before Hao Cheng could answer, Chu Bai answered first: "No matter how many layers there are, it doesn't count! Only yours counts!"
"This is a real three-dimensional chip!" Finally, Chu Bai added: "A three-dimensional semiconductor chip that combines silicon and carbon!"

Today's chips are mainly silicon semiconductors. There are also many institutions and companies in China that are researching carbon nanotube chips, but they are not mainstream at present, and there is no way to make general-purpose chips. They are still in the laboratory stage.

Hao Cheng's idea is a carbon-silicon fusion semiconductor chip that is mainly based on silicon and uses nanocarbon as the circuit channel.

Because of the characteristics of carbon nanotubes, it can be said that a three-dimensional layout of the circuit has been achieved.

(End of this chapter)